Development prospect of microelectronic technology
Contemporary microelectronic technology is developing towards high integration, high speed, low power consumption and low cost. Its progress mainly depends on the following aspects:
1. Improvement of manufacturing process. In terms of manufacturing process, it has developed from the initial single-layer plane distribution to the later multi-layer process (there are two ways: multi-layer high-density and multi-function), so as to reduce the cost and increase the function. The device manufactured by artificial superlattice process (a new process for manufacturing crystals by artificially controlling the crystal lattice size) is called superlattice semiconductor device. The speed of this device is 10-100 times faster than that of silicon semiconductor devices. The use of sensitive integrated circuits (integrating various sensitive components and peripheral circuits on - chips at the same time) can reduce the volume, reduce the cost, improve the reliability and increase the function. The integration method of the system will develop from two-dimensional structure to three-dimensional structure, which will achieve a new breakthrough in integration and open up a new and feasible way for the development of integrated circuits.
2. Update of materials. Scientists are widely exploring possible ways to replace silicon crystals with new materials. With the rapid development of microelectronic technology, the limitations of silicon materials have been gradually exposed. Using oxide semiconductor materials such as gallium arsenide and indium phosphide, superconducting materials and diamond materials to manufacture integrated circuits can improve the switching speed, radiation resistance and working temperature of integrated circuits (diamond integrated circuits can work normally at 500 ° C-700 ° C). On February 12, 2000, the University of Essen and the University of Hanover announced the successful joint development of germanium semiconductor on silicon plate. The switching speed of the integrated circuit made from this will be much faster than that of silicon integrated circuit. At the same time, the "biochip" developed by using the technology of storing information in the chemical chain of organic atoms has also made some progress.
3. Increase of core size. The increase of chip size can provide a material basis for the improvement of integration, and the larger the chip size, the lower the average cost of integrated circuit. In 1998, the chip size has increased from 3-4 inches to 8-10 inches. It has reached 12 inches. It is expected that the capacity of the chip will reach an alarming level in the next few years, that is, a chip can contain 1 billion components, and its circuit is only as thin as a few atoms. This will inevitably lead to a significant increase in chip function density and performance price ratio.
Application of microelectronic technology
Microelectronic technology is the technical field of the development and production of micro electronic components and circuits and the use of them to realize the functions of electronic systems. It is a new technology rising gradually with the development of integrated circuit technology, especially large-scale integrated circuit technology after the 1950s.
Microelectronic technology not only makes the miniaturization of electronic equipment and systems possible, but also causes great changes in the design, process and packaging of electronic equipment and systems. All traditional components, such as transistors, resistors and wires, will be connected to each other in an overall form. The starting point of design is no longer a single component, but the whole system or equipment
